Postdoctoral Fellow in Thin Film Engineering for Microsensors
Immigration Policy Lab
Postdoctoral Fellow in Thin Film Engineering for Microsensors
100%, Zurich, fixed-term
We are seeking a highly motivated and skilled Postdoctoral Fellow in Microsensor Film Engineering to join our dynamic and interdisciplinary research team. The successful candidate will systematically study and engineer nanomaterial film architectures on miniaturized (MEMS) substrates for integrated gas sensing devices. The central objective is to understand and control how deposition process parameters govern film architecture (e.g., thickness, porosity, roughness, grain/particle connectivity, interfaces, adhesion, and pattern fidelity) and how this architecture ultimately determines sensor performance and device reliability.
Project background
Miniaturized gas sensors are increasingly important for applications spanning environmental monitoring, industrial safety, healthcare, and smart infrastructure. While nanomaterials offer exceptional sensing potential, successful device translation hinges on reproducible, scalable, and well-understood thin-film architectures that can be deposited and patterned on MEMS platforms. This position targets the establishment of process–architecture–property–performance relationships, combining controlled deposition experiments with advanced characterization and device-level testing.
This position focuses on the deposition of nanomaterials onto MEMS substrates, the engineering and characterization of film architecture, and the integration and testing of gas sensor devices, both in the lab and in the field. Applicants are encouraged to explore and benchmark multiple deposition routes (including flame aerosol deposition, aerosol jet printing, inkjet printing, and related techniques), and to develop systematic parameter studies that enable robust and repeatable sensing layers.
Job description
- Systematic investigation of deposition process parameters and their influence on film architecture on MEMS/miniaturized substrates
- Engineering and tailoring film architectures (thickness gradients, porosity/connectivity, hierarchical structures, multi-layer stacks, functional/catalytic over-layers, patterned films) for sensing
- Benchmarking and comparing deposition techniques, such as flame aerosol deposition, aerosol jet printing, inkjet printing, spray/aerosol-based coating, and related approaches
- Establishing process–architecture–performance relationships, linking film morphology and interfaces to sensitivity, selectivity, response/recovery, drift, stability, and power consumption
- Integration of sensing films into MEMS devices, including packaging constraints, electrical interfacing, and robustness under realistic operating conditions
- Sensing characterization and testing, including calibration, repeatability, humidity/interference effects, aging, and statistical evaluation across sensor batches
- Collaborate closely with interdisciplinary teams (materials science, microfabrication, chemistry, device physics, modeling)
- Prepare manuscripts, reports, and presentations to disseminate findings
Profile
Qualification:
- PhD in mechanical/process engineering, materials science, micro/nano engineering, electrical engineering, chemistry, or a closely related field
- Demonstrated experience in thin-film engineering, nanomaterial deposition, or micro/nano-fabrication-related research
- Ability to work independently and as part of a multidisciplinary team
- Excellent written and verbal communication skills (proficient in English)
Preferred Qualification:
- Experience with one or more of: flame aerosol synthesis/deposition, aerosol jet printing, inkjet printing, spray coating, electrophoretic deposition (any relevant method)
- Experience with film architecture characterization on microstructured substrates (e.g., SEM/FIB-SEM, AFM, profilometry, ellipsometry, XRD, Raman, XPS, porosity metrics, image analysis)
- Experience with chemoresistive gas sensing and/or automated gas test infrastructure (flow control, humidity control, multiplexing)
- Familiarity with MEMS handling/integration (chip carriers, wire bonding, thermal management, reliability testing)
- Experience with reliability/stability testing and statistical analysis of repeatability across batches
Workplace
Workplace
We offer
- A highly motivated, multidisciplinary, and collaborative team environment
- Scientific mentoring and support for postdoctoral fellowship applications and career development
- Flexibility to develop your own research direction within the project framework
- Support to attend relevant (inter-)national conferences and build international visibility
- Opportunities to supervise junior researchers and contribute to teaching
- Access to state-of-the-art infrastructure and collaborative research networks
We value diversity and sustainability
Curious? So are we.
We look forward to receiving your application with the following documents:
- Motivation letter (max 1 page)
- Detailed CV
- Transcripts of all degrees including ranking information (English)
- Names and contact information of at least three references
- Representative published research work (Papers, thesis if possible)
Please submit the application documents using only the ETH online portal in a single merged PDF document, titled with your last name and initials as well as the application date (for example, name_application). Applications via email or postal services will not be considered.
For more information on our group can be found on our website.
Questions regarding the position should be directed to Prof. Andreas Güntner, by email at andregue@ethz.ch.
We evaluate applications on a rolling basis.
Earliest possible starting date: March 1st, 2026.